Summary: TOPPAN announces the establishment of a new factory in Singapore for high-density semiconductor package ‘FC-BGA (Flip Chip Ball Grid Array) boards’, aiming for operation start by the end of 2026.

On March 14th, TOPPAN (formerly Toppan Printing) announced plans to establish a new high-density semiconductor package “FC-BGA (Flip Chip Ball Grid Array) substrate” factory in Singapore, with the aim to commence operations by the end of 2026. The new facility is intended to meet the growing demand for advanced semiconductor technologies and support the production of FC-BGA substrates. Stay tuned for further updates on the construction progress and operational developments of TOPPAN’s semiconductor substrate factory in Singapore, as the company expands its presence in the semiconductor manufacturing industry.