“Okura Yusoki, PALTAC Form Technical Partnership for Commercialization of Cardboard Top Cutting Device”

On March 25th, Okura Yusoki and PALTAC announced that they have entered into a technical partnership (know-how licensing agreement) to advance the practical application of a device for cutting the top covers of cardboard cases.

This collaboration aims to enhance the efficiency and automation of processes related to cardboard packaging in logistics operations. The implementation of cutting-edge technologies, such as the cardboard top cover cutting device, demonstrates the commitment of Okura Yusoki and PALTAC to innovation in the logistics industry. Stay tuned for updates on the development and deployment of this technology in optimizing cardboard handling and packaging processes.